Taiwan plays a pivotal role in the global semiconductor supply chain. To accelerate chip innovation and industrial transformation, the National Science and Technology Council (NSTC) is advancing the Taiwan Chip-based Industrial Innovation Program (CbI Program). Leveraging Taiwan’s strengths in semiconductors, the program focuses on advancing AI applications, heterogeneous integration, startup development, and talent cultivation, driving technological innovation and industrial transformation while strengthening Taiwan’s global competitiveness in the semiconductor industry.
SEMICON Taiwan 2026 will take place from September 2 to 4 at the Taipei Nangang Exhibition Center (TaiNEX). The CbI Program will feature a dedicated pavilion at Booth T9002, 7F, Hall 2 of TaiNEX 2, showcasing key program achievements and cutting-edge technologies, and highlighting the latest progress in leveraging chip technologies to drive innovation and real-world applications across industries.
Seven Leading Industry and Academic R&D Teams to Showcase Next-Generation AI Chip Breakthroughs at Sep. 3 TechTalk
On the afternoon of September 3, from 13:30 to 16:00, the CbI Program pavilion will host a TechTalk Session featuring seven leading industry and academic R&D teams, including MediaTek, Phison Electronics, Winbond Electronics, Jmem Tek, the One-Stop Chip & System Design Platform team, Prof. Chia-Hsiang Yang’s team at National Taiwan University (NTU), and Prof. Shuenn-Yuh Lee’s team at National Cheng Kung University (NCKU).
The participating teams will share their latest technological breakthroughs, commercialization progress, and real-world applications in semiconductors and AI chips, offering insights into the development of next-generation chip technologies and their potential across industries.
Industry experts, technology partners, and professionals are cordially invited to visit the CbI Program pavilion, explore the latest developments in AI chips and semiconductor technologies, and exchange insights on innovative technologies and industrial applications.
Source：Taiwan Chip-based Industrial Innovation Office